As early as May of this year, Liu Zuohu, the founder of Yijia Mobile, sent a Weibo "to see the world from the perspective of VR. For Jiajia, it is both a challenge and an opportunity." In order to enter the mobile VR market in the future, set a flag. At that time, Google launched the Daydream virtual reality platform, and Liu Zuohu was optimistic about Google Daydream in the first timetable. Sure enough, a few days ago, a plus mobile phone said that the company will announce a new device at 1 pm EST on November 15 (about 2 am on November 16th, Beijing time), equipped with Qualcomm Snapdragon 821 processor. According to the leaked news, the device name is T3, and it is likely to be an upgraded version of the 1+3 mobile phone launched in June. One plus also revealed that a new mobile phone product will use Qualcomm Snapdragon 821 processor (2.15 and 2.35GHz versions) and AMOLED screen, although there are rumors that the company has problems in the supply of AMOLED screen. Other configurations include 8GB of RAM, 3500-4000 mAh battery, fast charging, and a custom Android interface Oxygen OS based on Android 7.0. If the T3 phone really uses AMOLED screen and Qualcomm Snapdragon 821 processor, it is not difficult to infer that this phone is likely to support Google's new mobile VR platform Daydream. This will inevitably become the first few moves in the mobile VR market of the mobile phone "Zhankeng".
Semiconductor Chip Carrier can be divided into thermo-electric modules, and the power electronic substrates.
Thermo-electric modules are plate-like semiconductor cooling devices that work by using the movement of heat when a current flows through the junction of two different metals. Compact, lightweight, and Freon-free, they are used in climate control seats of automobiles, cooling chillers, optical communications, biotechnology, air conditionners, dryers and a variety of consumer electronic products.
Application of Thermo-electric module Manufacturing Technology for Heat Dissipation and Insulation Substrate
Generally, organic and metal substrates are used in the circuit boards of low-power home appliances and computers.
In particular, silicon nitride substrates are attracting attention for use in power modules of inverters and converters because of the increase in sales of HEVs and EVs. Chip Carrier Package,Ceramic Chip Carrier,Plastic Leaded Chip Carrier,Chip Carrier Socket SHAOXING HUALI ELECTRONICS CO., LTD. , https://www.cnsxhuali.com
However, alumina, aluminum nitride and silicon nitride substrates are used in heat radiation insulated substrates of power modules that handle high power.