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About the US GAO Senmei RTG4 FPGA device and development tools
Microsemi Corporation (NYSE: MS) has released engineering samples of the RTG4â„¢ high-speed signal processing, radiation-tolerant programmable logic device (FPGA) in a ceramic quad flat package (CQFP). The new CQ352 package is designed for space applications and adheres to the CQFP industry standard. With 352 pins, it offers a more cost-effective integration solution compared to larger pin-count packages and is the only one used in high-speed, radiation-hardened FPGAs of its class.
CQFP packages are widely adopted in space missions due to their lower integration costs and proven assembly technology, making them easier to install on printed circuit boards (PCBs) than ceramic column grid array (CCGA) packages. This has made them a popular choice among global space customers, particularly for their rigorous installation, inspection, and testing procedures.
Minh Nguyen, Senior Marketing Manager for the U.S. GAO Space Market, stated, “We are excited to introduce one of the most commonly used space flight application packages into the Microsemi RTG4 FPGA family. This package provides greater cost-effectiveness compared to higher pin-count options. Adding this package beyond our existing CG1657 not only enhances the overall device portfolio but also reflects our long-term commitment to delivering innovative solutions that help customers confidently evaluate and design while meeting strict industry standards.â€
The RTG4 FPGA in the CQ352 package is well-suited for control applications that don’t require high I/O counts, such as satellites, space launch vehicles, planetary rovers, landers, and deep-space probes—especially those requiring frequent switching and high-temperature cycling. These applications can be challenging for CCGA packages. According to Euroconsult’s report, “Satellites Built and Launched by 2024,†satellite launches are expected to increase by 60% over the next decade, driven largely by civil and government agencies expanding and replacing their satellite systems.
The CQ352 version of the RTG4 FPGA includes 166 3.3V general-purpose I/Os, four embedded SpaceWire clock and data recovery circuits, and four high-speed serial/deserializer (SerDes) transceivers. It supports external physical coding sublayer (EPCS) or external component fast interconnect (PCIe) protocols. The number of look-up tables (LUTs), flip-flops, digital signal processing (DSP) blocks, and static random access memory (SRAM) modules matches those of the existing 1,657-pin CCGA packages.
RTG4 FPGA devices bring advanced capabilities to the market, combining a rich set of features to meet the growing demand for reliable and high-quality satellite payloads. They feature a reprogrammable, non-volatile flash structure that simplifies customer prototyping. The reconfigurable flash technology ensures full immunity to radiation in the harshest environments, eliminating the need for configuration refresh, unlike SRAM-based FPGAs. RTG4 devices support up to 150,000 logic cells, each with a LUT4 and flip-flop featuring built-in triple-module redundancy (TMR), and offer a total ionizing dose (TID) resistance of over 100 krad. They operate at up to 300 MHz without additional circuitry to suppress single-event upsets (SEUs).
The RTG4 development toolset is designed for high productivity, offering an easy-to-use, comprehensive environment that integrates industry-standard Synopsys SynplifyPro synthesis and Mentor Graphics ModelSim simulation tools. It delivers top-tier constraint management, debugging capabilities, and secure production programming support.
For decades, Microsemi has been a key supplier for NASA and various international space programs. The RTG4 is the latest milestone in its space innovation journey.
Microsemi offers the industry's broadest portfolio of radiation-tolerant products, including FPGAs, mixed-signal ICs, DC-DC converters, precision timing solutions, linear and POL hybrid circuits, custom hybrids, and radiation-resistant discrete components like JANS Class diodes and bipolar devices. The company is committed to supporting customers throughout their project lifecycles and continues to innovate, recently adding the LX7730 radiation-tolerant telemetry controller IC, the LX7720 radiation-tolerant power driver IC with rotation and position sensing, and the RTG4 FPGA family. Its reprogrammable flash technology provides robust resistance to radiation-induced configuration errors, offering a significant advantage over traditional SRAM-based FPGAs.
Products Description
OEM/ODM
available
Main Products
compression spring, tension spring, torsion spring, wire forming, etc.
Specification
wire diameter from 0.1mm to 40mm
Material
carbon steel (SWC), stainless steel (SUS), music wire (SWP), alloy steel, SEA9260/9254/6150, SUP9/SUP10/SUP12, 51CrV4, inconel X750, etc.
Surface Treatment
zinc plated, electrophoresis, oxidation black, powder coating, blasting, geomet, rust-preventative oil, nickel plated, etc.
Packaging
inner plastic bag, outer standard carton box.Or at your request.
Certificate
ISO/TS16949-2002, ISO9001-2000, ISO14000
Lead Time
samples:3-7 days; batch goods: 7-15 days after deposit recieved.
Payment Term
T/T, L/C, western union, paypal, etc.
Shipment
by sea, by air, UPS, TNT, Fedex, express delivery, etc.