April 29, 2024

High-brightness LED process technology still needs continuous improvement and innovation

LED light source has many environmental advantages, but in the early stage of heat treatment and high brightness design, there are still some technical bottlenecks that cannot be broken. However, under the continuous improvement of LED chip process, the brightness output of existing LEDs is closer. In the daily lighting needs, coupled with the IC solid-state component design, the LED light source design adds more application flexibility and advantages.


In particular, the LED light source is not easy to damage and has a long life. If the problem is not counted, it is compared with the traditional high-energy tungsten lamp (incandescent lamp) / halogen lamp / high pressure sodium lamp, CCFL fluorescent lamp with doubts about mercury pollution. LED is a new choice for alternative light sources that perform quite well.


However, in order to respond to different daily lighting applications, it is necessary to continuously improve the LED product design for LED lighting, light shape, heat dissipation design and overall cost of use, so that LED lighting is more practical, and it is no longer just about environmental protection. The ornament of appeal.


80W high-brightness LEDs can have a brightness of 6,400~8,000 lumens, lamps up to 100lm-W, and component life of over 50,000 hours.


LED lighting source, due to the difference in material characteristics of its own components, plus the principle of illumination is different from traditional lighting equipment. If the light shape is not processed and the lighting quality is improved, there are still many restrictions on directly replacing the light source of ordinary daily application with LED. In particular, key issues such as color rendering, illumination shape, illumination color, power conversion efficiency, etc., need to be improved by the process of the chip or the optical physical design of the lamp to further meet the needs of general lighting.


LED solid-state lighting still has high cost


In the actual lighting application market, LED solid-state lighting itself still has high unit price and high cost limit. In order to accelerate the popularization of LED lighting applications in a short period of time, relevant companies still need to focus on key items such as component cost, production technology, and verification standards. Improve cost efficiency one by one.


In terms of production technology, the final product has to be enhanced in terms of color temperature performance, color rendering and photoelectric conversion efficiency, as well as improved performance, as well as improved AC-DC power conversion, high-power drive control, light source heat dissipation and light shape processing. Technology, these are the key to the rapid spread of LED lighting technology.


High-brightness LEDs have longer service life than conventional high-brightness halogen lamps and sodium lamps, and can be made into outdoor lamps, saving maintenance costs.


It is also mentioned in the foregoing that the design of the LED lighting source must first improve the heat dissipation design of the lighting module. The integration of the heat dissipation mechanism is the key to whether the LED lighting product can maintain long life and low light decay. For example, the COB LED polycrystalline lamp board is used to fix the LED chip on the printed circuit board, and the LED chip can directly increase the heat conduction efficiency through the PCB contact, thereby improving the heat dissipation problem common to the LED lighting application.


LED carrier board design can improve component cooling efficiency


In order to respond to the design of high-power, high-brightness lighting applications, the original PCB-based version will use the metal core PCB material to increase the heat dissipation efficiency of the LED components, because the heat generated by the driving process can be achieved by the metal core of the PCB. To reduce the thermal impedance, and thus enhance the heat dissipation performance.


The metal core PCB uses MCPCB (Metal Core Printed Circuit Board) to reduce the thermal resistance design of the carrier. In order to reduce the cost, MCPCB selects aluminum as the carrier core, which has low cost, good heat dissipation and better corrosion resistance. .

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