Focusing on system operators' requirements for the stability of light-emitting diode (LED) light sources in different operating environments is more stringent. LEDs using Flip-chip packaging technology have higher reliability than the solid crystal mounting method of general LED packages. Degree, and has the advantages of shortening the process time of high-temperature baking, high yield, good thermal conductivity, high light output, etc., and stands out in the market. Liang Jiahao, director of the outdoor lighting application department of Yiguang Electronics, pointed out that temperature will affect the performance of materials, which is closely related to the level of stress. Liang Jiahao, director of the outdoor lighting application department of Yiguang Electronics, said that the system design industry is increasingly demanding LED light source specifications, not only the size and optical characteristics. For LED light sources under different conditions of use, the requirements for long-term reliability can be maintained, such as heat dissipation and stress. The material properties and other properties have prompted the flip chip packaging technology to become a trend. Liang Jiahao analysis, the characteristics of flip chip packaging technology is to shorten the LED process at high temperature baking time, can reduce the material thermal stress; plus the heat generated by the chip is transmitted to the substrate via gold bumps, so the heat conduction effect is good; and the chip is removed The electrode blocks the light-emitting area and increases the amount of light emitted; and the process is simplified, and the yield is easy to control. Compared with the medium and high power LED packages on the market, silver-glued LED dies are generally used, which have high conductivity and help heat dissipation. The flip chip packaging technology uses gold tin or tin metal layers to laminate LED dies. At lower junction temperatures, higher steady-state brightness is achieved, resulting in both heat dissipation and high stability. Liang Jiahao explained that since the steady-state brightness is most valued by buyers, flip chip packaging technology can better meet the market's expectation for high reliability. At this stage, LED die attach materials are mainly divided into epoxide, silver paste with epoxide, gold tin/tin and indium. At present, LED solid crystal production methods can be divided into three types: traditional Die Bond plus Wire Bond process, traditional die bond matching wire bonding process and flip chip technology process, each with advantages and disadvantages. Different from the traditional die-bonding and wire bonding process, it adopts silver glue and epoxy to bond LED crystals, and adopts the traditional die-bonding and wire bonding process to change the gold-tin metal layer. Liang Jiahao pointed out that at this stage, Taiwan's LED packaging factory can use these three major types of processes to produce LED solid crystals, of which the flip chip technology has the highest threshold. Different from the solid crystal mode of the general LED package, the flip chip packaging technology directly flips the chip to the gold bumps on the substrate, and then uses the applied energy to achieve the purpose of solid crystal. The process of flip chip packaging technology must consider material quality, such as substrate plating, chip electrodes, etc., as well as magnetic nozzle design, gold wire material / wire diameter, process parameters. Cummins 0-20KW Diesel Generator Cummins 0-20Kw Diesel Generator,Cummins Portable Power Generator,Cummins Open Type Power Generator,Cummins Container Power Generator Shanghai Kosta Electric Co., Ltd. , https://www.shkostagenerator.com