May 12, 2024

Upgrade "China Core"_CRRC Times Electric Third-generation Power Semiconductor Device Production Line Construction

On February 7, Zhuzhou CRRC Times Electric SiC (silicon carbide) production line, workers are busy producing.

Upgrade "China Core"_CRRC Times Electric Third-generation Power Semiconductor Device Production Line Construction

Through the transparent glass baffle, you can see the pink uniform technician and the blue uniform equipment personnel who are "armed" from head to toe, busy in front of one instrument, and the whole workshop is more like a surgical room. Or biochemical laboratory.

On February 8th, the reporter came to Zhuzhou Zhongche Times Electric Co., Ltd. (hereinafter referred to as “Time Electric”), a subsidiary of CZ Zhuzhou Electric Locomotive Research Institute Co., Ltd. (hereinafter referred to as “Zhongzhou Zhuzhou Institute”). The third-generation power semiconductor device SiC (silicon carbide) chip production line has just been formed.

The production line is the first 6-inch SiC chip production line in China, and has won the support of key projects such as the national “02” special project and the National Development and Reform Commission new materials.

Before entering the tour, all personnel must wear white uniforms and shoes. Even so, you can only visit the glass outside the workshop. The employees entering the workshop have stricter requirements. They must wear hoods, masks, gloves and uniforms.

“The workshop is cleaner than the operating room, and the control of suspended particles is very strict. There are no more than 10 suspended particles per cubic meter of space larger than 0.1 micron; each particle may damage a chip.” ERA products of Times Electric Semiconductor Division Li Chengzhan, Minister of Development, said.

This is the highest standard of the current international SiC chip production line.

Li Chengzhan introduced that power semiconductor device production has experienced three generations of thyristor, IGBT and SiC technology. SiC is the most advanced technology and will become the mainstream in the next five years.

"Properly speaking, power semiconductor devices are the core power of high-speed trains." Li Chengzhan introduced that the IGBT chips independently developed by CZ Zhuzhou have installed "China Core" on China's high-speed rail.

Around 2010, Times Electric began to conceive SiC chips. At that time, the latest technology was monopolized by foreign countries, and through complete self-exploration, the implementation plan could be completed little by little.

Compared with IGBT, SiC can effectively improve system efficiency, reduce energy consumption, reduce system unit size and weight, improve system reliability, and reduce high-speed train power conversion loss by 30% to 50%.

In order to bring the upgraded version of "China Core" to the market as soon as possible, the project team sacrificed a lot of rest time and made great efforts.

The production plant was delivered in August 2017. In December, the SiC chip production line completed the technical debugging of the process equipment. In January this year, the first batch of chips was successfully produced. At the moment, the staff is continuing to improve the stability of the process and make a final sprint for mass production.

“Each process needs to balance between ten or even dozens of process parameters, and the work is very difficult.” Chen Ximing, a technician of the film group, said that if you are lucky, you can find the optimal process parameters after 10 times of debugging; It takes dozens of times hundreds of times, and the most one has undergone more than 500 adjustments.

"A lot of enterprises come to dock. At present, there are orders from rail transit, electric vehicles, new energy and other fields. We must achieve stable production as soon as possible and speed up the market. This is also the need for China's power semiconductor devices to seize the future technological and industrial commanding heights. "Li Chengzhan said that by 2023, the global SiC power semiconductor device market can reach 10 billion US dollars.

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